Tencent ramps up overseas AI push with wider roll-out of flagship Hy3 model

South China Morning Post - Aug 5, 2026

Tencent Holdings is ramping up its overseas push for its flagship Hy3 artificial intelligence model, joining a wave of Chinese technology firms taking aim at the world’s leading players. On Wednesday, the Shenzhen-based technology giant rolled out Hy3 to global developers, enterprises and users through its workplace agentic tool WorkBuddy, creation studio Tencent Design Miora and model platform TokenHub. According to Tencent, Hy3 would be available free of charge worldwide on WorkBuddy until...

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Alibaba’s RISC-V IP powers over 6 billion shipped chips as tech giant targets AI, autos

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CXMT shares fall 7.8% despite blockbuster earnings figures

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The AI promise was automation. The reality? Managing digital workers

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China’s proposed AI tech export bans may create short-term costs, long-term gains: analysts

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China’s proposed AI tech export bans may create short-term costs, long-term gains: analysts

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Alibaba to embed AI throughout Taobao, Tmall merchant operations in 2027: executive

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Alibaba to embed AI throughout Taobao, Tmall merchant operations in 2027: executive

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Alibaba Group Holding’s two major domestic online marketplaces, Taobao and Tmall, plan to greatly expand the use of artificial intelligence across merchants’ operations next year, a senior executive said, as the e-commerce giant doubles down on the technology to drive growth amid a challenging consumer landscape. “Starting next year, AI will comprehensively enter the internal enterprise workflows of merchants,” Liu Bo, president of Tmall, said at the company’s Singles’ Day media briefing on...

ASML eyes hybrid bonding, report finds, as Chinese firms adopt chip packaging technique

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Dutch semiconductor equipment giant ASML is expanding into next-generation hybrid bonding, a technique that creates dense electrical connections by directly joining chips or silicon wafers, according to a new report. Major Chinese companies are also adopting the technology to improve chip performance. ASML submitted 27 patent families related to hybrid bonding tools between December 2022 and November 2024, according to a report published by semiconductor and AI supply chain research firm...

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